MINIMUM QUALIFICATIONS:
- Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s degree preferred
- Three years of hands on experience working in photolithography in a process or manufacturing engineer
- Strong experience in SPC, Design of Experiments (DOE), and photoresist modeling
- Proficient in the use of Microsoft Office Applications
Required Knowledge, Skills, and Abilities:
- Strong knowledge of photolithography fabrication techniques using steppers/scanners, spin-on photoresist tracks, and developer tools.
- Strong knowledge of semiconductor device measurement tools, practices, and techniques
- Knowledge and experience using JMP or Excel and the ability to create macro formulas
- Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
- Able to design experiments, analyze results, and recommend corrective action
- Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
- Able to work productively and collaboratively with all levels of employees and management
- Able to comply with all safety policies and procedures
- Demonstrated organizational and time management skills
- Demonstrated problem-solving and trouble shooting skills
- Flexible and able to prioritize
The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Photolithography Manufacturing Engineer works primarily in an office environment. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 30 pounds.
*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
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